Overview

Category: Engineering
Location: Baltimore, Maryland
US Citizenship Required for this Position: Yes
Clearance Type: None
Telecommute: No -Teleworking not available for this position
Shift: 1st Shift
Travel Required: Yes, 10 % of the Time
Positions Available: 1

At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We’re looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we’ll support yours of expanding your personal network and developing skills, whether you are new to the field or an industry thought-leader. At Northrop Grumman, you’ll have the resources, support, and team to do some of the best work of your career.

Northrop Grumman’s Manufacturing Technology Engineering organization is seeking a Manufacturing Engineer to support our advanced packaging initiatives focused around 2,2.5 and 3D assembly technologies.

The Manufacturing Technology Engineering (MTE) team engages with low manufacturing readiness level (MRL) programs to ensure manufacturing capabilities required for strategic applications are being developed and implemented into production. The Manufacturing Engineer will engage with product development during pre-proposal and proposal program phases to offer insight into higher yielding, novel and evolving advanced microelectronics manufacturing processes.

The Manufacturing Engineer will identify, scope, and lead development efforts leveraging advanced semiconductor packaging technologies to enable higher capability and lower cost next generation sensors. She/he will also provide manufacturing technical support and direction to develop and fabricate 2, 2.5 and 3D advanced packaging assemblies and processes with an eye towards future production requirements and growth.

Responsibilities include, but are not limited to, the tasks outlined below:
•Creating and executing project plans (tasks, resources, schedules) for process and product development activities
•Managing and executing capital equipment projects through procurement, installation and release for production use
•Working with cross-functional teams, programs and other supporting organizations for packaging manufacturing support
•Solving of manufacturing problems (related to materials, designs, equipment, people) in a timely manner
•Developing and optimizing process parameters, process documentation and automatic equipment programs
•Supporting and/or leading production support activities such as the training of new personnel, the design of operator training materials and supporting factory maintenance personnel with the troubleshooting and repair of process equipment

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high visibility environment; and work well as part of a team.

This requisition may be filled as a Principal Engineer or Senior Principal Engineer based on the requirements below.

MANUMS

Basic Qualifications for an Principal Engineer:
•Bachelor of Science degree or higher in Engineering or related STEM area
•At least 5 years of relevant experience (3 years with an MS degree)
•Experience with semiconductor fabrication processes and technology with strong technical and analytical skills and problem-solving techniques
•Experience managing projects •Fluency in MS Office software applications
•Ability to obtain and maintain a US Secret Security Clearance (US Citizenship is required.)

Basic Qualifications for a Senior Principal Engineer:
•Bachelor of Science degree or higher in Engineering or related STEM area
•At least 9 years of relevant experience (7 years with an MS degree)
•Experience with semiconductor fabrication processes and technology with strong technical and analytical skills and problem-solving techniques
•Experience managing projects •Fluency in MS Office software applications
•Ability to obtain and maintain a US Secret Security Clearance (US Citizenship is required.)

Preferred Qualifications:
•Broad knowledge of semiconductor RF/digital packaging, materials and assembly processes including some of these: wafer bumping, wafer bonding, silicon interposers and flip chip assembly
•Experience with wafer level semiconductor manufacturing technology
•Experience with standard integrated circuit components tools such as pick & place, reflow and underfill dispense
•Experience with finite element modeling for electrical, structural and thermal analysis, such as HFSS, ANSYS, HFSS, and ICEPAK etc.
•Experience with CAD software for package design and modeling •Experience managing project budgets, resources and timelines
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.Tracking

To Apply: https://www.jobg8.com/ATSApply.aspx?Dydize0q0as8QlnIbRYDlgf